发明名称 HEATING BODY FOR SOLDERING AND SOLDER CONNECTING METHOD
摘要 PROBLEM TO BE SOLVED: To simultaneously perform solder connection even upon conductors of different diameters by preventing the position of a conductor to connect a solder from being deviated, and stabilizing heat balance. SOLUTION: A heating body 1 for soldering comprises a heating conductor 11 for electrifying a current; a heater 13 which is provided in the distal end of the heating conductor 11 and comprises a heating face 13A for heating and pressurizing one or more conductors 9 of a suitable number to be connected via a solder to one or more terminals of a suitable number arrayed in parallel on a substrate 3; and one or more grooves 17 of a suitable number which are provided on the heating face 13A in accordance with the conductors and are in contact with the conductors 9 in at least two points. Since the grooves 17 are in contact with the conductors 9 uniformly in at least two points, the conductors 9 are not deviated from predetermined positions and solder connection can be performed with stable heat balance. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005332920(A) 申请公布日期 2005.12.02
申请号 JP20040148945 申请日期 2004.05.19
申请人 FUJIKURA LTD 发明人 TACHIBANA YUUKO;ASHIDA SHIGERU;MATSUURA KATSUHISA
分类号 B23K3/047;B23K101/38;H05K3/34;(IPC1-7):H05K3/34 主分类号 B23K3/047
代理机构 代理人
主权项
地址