| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayered wiring board wherein conductivity paths are established between the front and rear surfaces of a core substrate to make a high density wiring possible and a semiconductor chip can be stably and surely mounted, and also to provide its manufacturing method. SOLUTION: In the multilayered wiring board having interconnections formed on top of the core substrate via an electric insulation layer, the core substrate is formed with a plurality of through holes and has a conductive material located inside the through holes to establish the conductivity paths between the front and rear surfaces. On one surface of the core substrate, the conductive material projects from the surface of the core substrate to form bumps having such a shape as to rise nearly at the center. COPYRIGHT: (C)2006,JPO&NCIPI |
