发明名称 PLASMA TREATMENT DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a plasma treatment device capable of uniformly adsorbing and fixing an object to be treated when plasma treatment is carried out, and capable of applying uniform plasma treatment to the object to be treated without causing abnormal arcing between a solid dielectric member and electrodes facing each other eve if a high voltage is impressed. <P>SOLUTION: This plasma treatment device has a pair of the electrodes facing each other, the porous solid dielectric member installed on at least one facing surface of the electrode, and an adsorbing means to adsorb and fix an object to be treated to the porous solid dielectric member by sucking the porous solid dielectric member. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005332784(A) 申请公布日期 2005.12.02
申请号 JP20040152525 申请日期 2004.05.21
申请人 SEKISUI CHEM CO LTD 发明人 IWANE KAZUYOSHI
分类号 H05H1/24;C08J7/00;H01L21/304;H05H1/46 主分类号 H05H1/24
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