发明名称 PROBE PAD, SUBSTRATE HAVING SEMICONDUCTOR DEVICE, METHOD OF TESTING SEMICONDUCTOR DEVICE AND TESTER FOR TESTING SEMICONDUCTOR DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a pad for probe sensing for testing electrically the semiconductor device without attacking the device, a substrate having a semiconductor device, a method of testing the semiconductor device and a tester for testing the semiconductor device. <P>SOLUTION: In the pad for probe sensing for testing electrically the semiconductor device without attacking the device, the substrate having the semiconductor device, the method of testing the semiconductor device and the tester for testing the semiconductor device, the probe pad includes a probing region with which a probe needle makes contact. A sensing region borders an edge of the probing region, and senses whether the probe needle contacts apart from the probing region. The semiconductor device is tested using the probe pad whether a location the probe needle of contacting the pad is defective. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p>
申请公布号 JP2005333128(A) 申请公布日期 2005.12.02
申请号 JP20050136308 申请日期 2005.05.09
申请人 SAMSUNG ELECTRONICS CO LTD 发明人 KIN SHOSHOKU;SON TAISHOKU;LEE DOO-SEON;KIM KUN-UP
分类号 G01R31/28;G01R1/067;G01R31/02;H01L21/66;(IPC1-7):H01L21/66 主分类号 G01R31/28
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