发明名称 STRUCTURE AND MOLDING METHOD OF SHEATHING RESIN IN CAPACITOR ELEMENT
摘要 PROBLEM TO BE SOLVED: To provide the structure of a sheathing resin which improves earthquake resistance and environmental properties accompanying temperature or humidity change and which is suitable, in addition, for a mass production, and also to provide a manufacturing method. SOLUTION: An epoxy resin 16 and a silicone resin 17 are poured and charged as sheathing resins of a capacitor element 12 in the space S of a housing 13. The epoxy resin 16 has a larger (higher) specific gravity than the silicon resin 17. Accordingly, the epoxy resin 16 is sunk naturally to the lower part in the space S of the casing 13. Moreover, the silicone resin 17 is floated on the upper surface of this epoxy resin 16, and laminated as upper and lower two charge layers. And, when the sheathing resin of the capacitor element 12 is charged, the epoxy resin 16 smoothly flows in an interval G1 constituted from the bottom 12b of the capacitor element 12 and the inner bottom 13c of the casing 13. The epoxy resin 16 rapidly flows in a whole region of the inner bottom of the casing 13. The sheathing resin is cured and formed as the resin layer of the lower layer of the capacitor element 12. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005332875(A) 申请公布日期 2005.12.02
申请号 JP20040148024 申请日期 2004.05.18
申请人 SHOWA DENKI KK 发明人 FUJIMURA YUTAKA
分类号 H01G4/224;H01G13/00;(IPC1-7):H01G4/224 主分类号 H01G4/224
代理机构 代理人
主权项
地址