REINFORCING RESIN AND SEMICONDUCTOR BOARD DEVICE EMPLOYING IT

摘要

PROBLEM TO BE SOLVED: To solve a matter that a work (repair) for removing and replacing a poor semiconductor package 1 becomes difficult when conventional reinforcing resin is used in a semiconductor package and a semiconductor board device, i.e. the reinforcing resin remains on a mother board and repairableness is damaged. SOLUTION: In the semiconductor substrate device comprising a mother board 13, and a semiconductor package 11 fixed to the upper surface of the mother board with the joint of the semiconductor package 11 and the mother board 13 being reinforced with reinforcing resin 15, the reinforcing resin 15 is repairable resin principally comprising thermosetting resin and exhibits elastic modulus of at least 3.1 GPa after heat curing. COPYRIGHT: (C)2006,JPO&NCIPI