发明名称 MATERIAL REMOVING METHOD, MATERIAL REMOVING DEVICE AND MACHINING TOOL
摘要 PROBLEM TO BE SOLVED: To provide a material removing method, a material removing device, and a machining tool, which remove material by simple removing operation. SOLUTION: In this material removing method, an inclination process of revolving a first revolving table 102 to incline a rotating shaft of a base metal 10 to the horizontal plane. After that, when a holding releasing process of releasing the base metal 10 from holding of a first chuck 140 is performed, the base metal 10 drops owing to its dead load, and the first revolving table is stopped with a part of the base metal 10 projected from the end part of the first revolving table 102. When the first revolving table 102 is revolved substantially horizontally in the revolving process, the first revolving table is revolved with a part of the base material 10 projected from the first revolving table 102. The base metal 10 is taken out from an introduction port 123A to remove the base metal 10. Thus, the base metal 10 is moved in the first revolving table 102 by its dead load in the inclination process and the holding releasing process, whereby the base metal 10 is removed without a special feeding mechanism to simply remove the material. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005329494(A) 申请公布日期 2005.12.02
申请号 JP20040149165 申请日期 2004.05.19
申请人 SEIKO EPSON CORP 发明人 KIKAWA TAKAO
分类号 B23B3/16;B23B3/30;B23B15/00;(IPC1-7):B23B3/16 主分类号 B23B3/16
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