| 摘要 |
<P>PROBLEM TO BE SOLVED: To uniformize distribution of a resin in an abrasive cloth by reducing scattering of distribution of the resin in the abrasive cloth as little as possible. <P>SOLUTION: A dry type urethane resin solution is impregnated into a substrate and the impregnated substrate is dried by heating and then, the treated substrate is passed through a pair of heat rolls and treatment for heating the substrate under pressure at a higher temperature than softening temperature of an urethane resin is carried out. As a result, the resin which is unevenly distributed in high density on the surface side of the substrate is transferred to the interior to uniformize the distribution of the resin on the surface side which becomes an abrasive surface and shortening of the time required for dummy polishing is performed, compared with the abrasive cloth of conventional example and productivity of a semiconductor wafer is improved. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
