发明名称 SURFACE-TREATED AL PLATE FOR HEATSINK, HEATSINK USING SAME, AND MOUNTING COMPONENT MADE BY REFLOW-SOLDERING HEATSINK ON MOUNTING SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a surface-treated Al plate for a heatsink which has a high thermal conductivity and adhesion when installed on a mounting substrate with an adhesive and can be installed on the mounting substrate easily and at a low cost, and to provide the heatsink using the surface-treated Al plate and a mounting component made by reflow-soldering the heatsink on the mounting substrate. SOLUTION: The surface-treated Al plate is made by forming a Zn layer by substitutional plating on the surface of an Al substrate, then forming an Ni layer or both Ni and Sn layers on the Zn layer by plating, and then selectively forming a layer for improving the thermal radiation. The surface-treated Al plate is used as the heatsink. The heatsink is reflow-soldered on a circuit, etc. of the mounting substrate to fabricate the mounting component. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005332840(A) 申请公布日期 2005.12.02
申请号 JP20040147184 申请日期 2004.05.18
申请人 TOYO KOHAN CO LTD 发明人 HAYASHIDA TAKAHIRO;UECHI MASAHITO;YAMANE HIROYUKI
分类号 H05K7/20;H01L23/373;(IPC1-7):H05K7/20 主分类号 H05K7/20
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