| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a printed wiring board which increases the adhesiveness between an inner layer interconnection exposed in the bottom face of a via hole and an interconnection connected to the inner layer interconnection by a process which is not a wet one. SOLUTION: The method of manufacturing the printed wiring board comprises: the process (a) wherein part of the resin layer of an object to be processed which consists of a basic substrate formed with the inner layer interconnection on the surface and the resin layer, so formed on the surface of the basic substrate as to cover the inner layer interconnection is removed by reactive ion etching to form the via hole, wherein the inner layer interconnection is exposed in the bottom face; and the process (b) wherein the bottom face of the via hole formed in the process (a) is exposed to plasmas of a noble gas to clean the surface of the inner layer interconnection exposed in the bottom face of the via hole. COPYRIGHT: (C)2006,JPO&NCIPI |
