| 摘要 |
PROBLEM TO BE SOLVED: To prevent an electronic component from being carried unexpectedly with an absorption nozzle that returns after the electronic component held by the absorption nozzle has been mounted in the fixed location of the board in the electronic component mount process. SOLUTION: To ensure the sufficient plate thickness T2 of the end face 3, thinning the plate thickness T1 of the plate film 14 at the side 4 of an electronic component main body 5 that causes an error, vibration plating takes place in a way that the total media surface area is 1.5 to 3.5 times larger than the total surface area of the conductive ground layer 12 of the electronic component body 5 in the plating vessel, and the distribution ration is within a range from 30 to 50% in the expression äA/(A+B)}×100 [%] where the plate weight of unit area of the ground layer 12 is A, and that of media is B. COPYRIGHT: (C)2006,JPO&NCIPI
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