发明名称 METHOD FOR MANUFACTURING SAW DEVICE
摘要 PROBLEM TO BE SOLVED: To achieve frequency stability with high accuracy and high frequency accuracy at a mass production level in manufacturing an SAW (surface acoustic wave) device such as an SAW oscillator. SOLUTION: To manufacture the SAW oscillator having desired operating frequency f0 and frequency stability±appm, frequency variation width (ppm) that can occur after package sealing is predicted as +b1 and -b2 and frequency stability (ppm) is set to +(a-b1) and -(a-b2) in a process for performing frequency adjustment by etching the surface of a piezoelectric substrate of an SAW chip mounted on the base of the package. In an orthogonal coordinates system where a horizontal axis x is frequency deviation to the operating frequency f0 and a vertical axis y is frequency variation width within a prescribed operating temperature range, the frequency of a target value is determined to perform frequency adjustment so as to place frequency deviationΔf0 about frequency variation widthΔfT of the SAW oscillator within -(a-b2)≤x≤(a-b1) and 0≤y≤x+(a-b2) and so as to preferably satisfy a straight line y=2x-(b2-b1). COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005333502(A) 申请公布日期 2005.12.02
申请号 JP20040151107 申请日期 2004.05.20
申请人 SEIKO EPSON CORP 发明人 TAKEBAYASHI YUICHI;MAEDA YOSHIO
分类号 H03H3/10;H03H9/145;(IPC1-7):H03H3/10 主分类号 H03H3/10
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