| 发明名称 |
SUBSTRATE, SEMICONDUCTOR APPARATUS, AND METHOD FOR MANUFACTURING THE SUBSTRATE |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate including an inductor, a semiconductor apparatus, and a method for manufacturing the substrate whereby the inductor can be reduced in size with a high inductance. <P>SOLUTION: An inductor 26 is configured such that wires 27 shaped like a comb are covered with an electrodeposition resin 28 containing a filler of a high-permeability material. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
| 申请公布号 |
JP2005333081(A) |
申请公布日期 |
2005.12.02 |
| 申请号 |
JP20040152341 |
申请日期 |
2004.05.21 |
| 申请人 |
SHINKO ELECTRIC IND CO LTD |
发明人 |
HORIKAWA YASUYOSHI;SHIMIZU NORIYOSHI |
| 分类号 |
H05K1/16;H01F17/00;H01F17/04;H01F41/04;H01L21/56;H01L23/12;H01L23/498;H01L25/16;H01L29/00;H05K3/28;H05K3/46 |
主分类号 |
H05K1/16 |
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