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发明名称
微流体驱动装置及其组装方法
摘要
一种微流体驱动装置及其组装方法,该方法包含提供一第一基板、一第二基板及一置于该第一基板与第二基板之间之弹性中间层。该第二基板具有复数个自该第二基板之上表面向上凸出的接合销,接合销穿过该第一基板与弹性中间层之对应的复数个接合孔与开口。将该接合销的顶端热压变形而扩大便能将这三层密封结合在一起,形成微流体驱动装置。
申请公布号
TW200538384
申请公布日期
2005.12.01
申请号
TW093114182
申请日期
2004.05.20
申请人
洹艺科技股份有限公司
发明人
韦雅各;郭远峰;王绍祖;李俊贤
分类号
B81B3/00;B81C3/00
主分类号
B81B3/00
代理机构
代理人
黄庆源
主权项
地址
新竹市科学工业园区工业东九路7号
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