发明名称 LIQUID METAL CONTACT MICRORELAY
摘要 Liquid metal microrelays may be made where a contact is formed by constraining a quantity of liquid metal at the end of a contact support suspended over a substrate. Movement of the contact support typically drags the liquid metal along the surface of the substrate and allows the liquid metal to bridge contacts located on the substrate. Coplanar waveguides may be used for the switched signal instead of microstrip transmission lines to reduce transmission line discontinuities due to impedance changes.
申请公布号 US2005264385(A1) 申请公布日期 2005.12.01
申请号 US20040857306 申请日期 2004.05.28
申请人 SIMON JONATHAN;ROSENAU STEVEN A 发明人 SIMON JONATHAN;ROSENAU STEVEN A.
分类号 H01H29/00;H01H51/22;H01H59/00;H01P1/12;(IPC1-7):H01H51/22 主分类号 H01H29/00
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