| 发明名称 |
METHOD AND APPARATUS FOR STACKING ELECTRICAL COMPONENTS USING OUTER LEAD PORTIONS AND EXPOSED INNER LEAD PORTIONS TO PROVIDE INTERCONNECTION |
| 摘要 |
A stacking structure is described that permits stacking of electrical components with no requirement for an ancillary stacking framework. Electrical components are fabricated with inner and outer lead portions that provide connection to a substrate and to other electrical components in a stack.
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| 申请公布号 |
US2005263311(A1) |
申请公布日期 |
2005.12.01 |
| 申请号 |
US20040856452 |
申请日期 |
2004.05.28 |
| 申请人 |
TSAI CHEN-JUNG;LIN CHIH-WEN |
发明人 |
TSAI CHEN-JUNG;LIN CHIH-WEN |
| 分类号 |
H01L23/28;H01L23/31;H01L23/495;H01L25/10;H05K5/06;(IPC1-7):H01L23/28 |
主分类号 |
H01L23/28 |
| 代理机构 |
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