发明名称 |
WIRE-BONDING METHOD FOR CHIPS WITH COPPER INTERCONNECTS BY INTRODUCING A THIN LAYER |
摘要 |
A wire-bonding method for chips with copper interconnects by introducing a thin layer is provided for solving the problem of oxidizing a copper bonding-pad during bonding processing in order not to deteriorate the bonding strength and yield rate thereof. The wire-bonding method of the present invention comprises: a step for providing a chip with a copper bonding-pad; another step for providing an aqueous solution to form a Cuprous oxide thin layer on the copper bonding-pad; and yet another step for setting a plurality of copper interconnects on the copper bonding-pad and providing an ultrasonic power for removing the Cuprous oxide layer to have the interconnects bonded on the copper bonding-pad.
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申请公布号 |
US2005266672(A1) |
申请公布日期 |
2005.12.01 |
申请号 |
US20040855161 |
申请日期 |
2004.05.26 |
申请人 |
JENG YEAU-REN;CHIU SANG-MAO |
发明人 |
JENG YEAU-REN;CHIU SANG-MAO |
分类号 |
H01L21/44;H01L21/607;H01L23/485;(IPC1-7):H01L21/44 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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