发明名称 METAL DEPOSITION
摘要 A method for electroless plating of metal on a laser-patterned substrate. A substrate is provided on which both a thermal imaging layer and catalytic layer are deposited. On exposure to a laser beam, sufficient levels of radiation are converted to heat in the thermal imaging layer to render the exposed regions of the adjacent catalytic layer inactive. The laser-patterned substrate is then exposed to a reaction solution which initiates the growth of a metal film on the unexposed regions of the catalytic layer.
申请公布号 WO2005079126(A3) 申请公布日期 2005.12.01
申请号 WO2005GB00458 申请日期 2005.02.10
申请人 PLASTIC LOGIC LIMITED;CONDUCTIVE INKJET TECHNOLOGY LIMITED;BANACH, MICHAEL, J.;MILLS, JOHN;WATTS, JAMES;HUDD, ALAN, LIONEL;FOX, JAMES, EDWARD;BENTLEY, PHILIP, GARETH 发明人 BANACH, MICHAEL, J.;MILLS, JOHN;WATTS, JAMES;HUDD, ALAN, LIONEL;FOX, JAMES, EDWARD;BENTLEY, PHILIP, GARETH
分类号 C23C18/16;C23C18/28;C23C18/30;H05K3/18 主分类号 C23C18/16
代理机构 代理人
主权项
地址