发明名称 |
Flex-based circuit module |
摘要 |
A form standard provides a physical form that allows many of the varying package sizes found in the broad family of CSP packages to be used to advantage while employing a standard connective flex circuitry design that is disposed about the form. In a preferred embodiment, the form standard will be devised of heat transference material such as copper to improve thermal performance.
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申请公布号 |
US2005263872(A1) |
申请公布日期 |
2005.12.01 |
申请号 |
US20050173445 |
申请日期 |
2005.07.01 |
申请人 |
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发明人 |
CADY JAMES W.;WILDER JAMES;ROPER DAVID L.;WEHRLY JAMES D.JR. |
分类号 |
H01L23/02;H01L23/31;H01L23/367;H01L23/498;H01L23/538;H01L25/10;H05K1/14;H05K1/18;H05K3/36;(IPC1-7):H01L23/02;H01L23/48 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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