发明名称 |
Patterned structure for a thermal interface |
摘要 |
The present invention provides a thermal interface with a first and a second face that are in contact to each other by a thermal conducting material. A first face includes grooves that are at least partly filled with the thermal conducting material, wherein at least two types of grooves are arranged, namely first grooves having a larger width than second grooves. The first face comprises an array with protrusions that are confined by the second grooves, the array being divided by the first grooves into sub-arrays.
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申请公布号 |
US2005263879(A1) |
申请公布日期 |
2005.12.01 |
申请号 |
US20050141932 |
申请日期 |
2005.06.01 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
MICHEL BRUNO;BRUNSCHWILER THOMAS J.;ROTHUIZEN HUGO E.;KLOTER URS |
分类号 |
H01L23/10;H01L23/42;(IPC1-7):H01L23/10 |
主分类号 |
H01L23/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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