发明名称 |
Heating device |
摘要 |
The present invention provides a heating device which is rigid with little likelihood of warping. The workpiece mounting surface has a high thermal conductivity, and there is improved heat uniformity, and rapid cooling is possible. The heating device of the present invention comprises: a mounting part for mounting the workpiece; a heating part which has a resistance heating element and which heats the mounting part; and a support part which supports the mounting part and heating part. The Young's modulus for each of the mounting part and support part is 100 GPa or greater. By having a Young's modulus of 100 GPa or greater, even if the mounting part is thin, there is little deformation when pressed by a probe card.
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申请公布号 |
US2005263516(A1) |
申请公布日期 |
2005.12.01 |
申请号 |
US20050140668 |
申请日期 |
2005.05.27 |
申请人 |
SUMITOMO ELECTRIC INDUSTRIES, LTD. |
发明人 |
NATSUHARA MASUHIRO;NAKATA HIROHIKO;KUIBIRA AKIRA;SHINMA KENJI |
分类号 |
H05B3/20;F27B17/00;F27D11/00;F27D99/00;H01L21/00;H01L21/02;H01L21/66;H01L21/68;H01L21/683;H05B3/06;H05B3/10;H05B3/74;(IPC1-7):F27D11/00 |
主分类号 |
H05B3/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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