发明名称 Heating device
摘要 The present invention provides a heating device which is rigid with little likelihood of warping. The workpiece mounting surface has a high thermal conductivity, and there is improved heat uniformity, and rapid cooling is possible. The heating device of the present invention comprises: a mounting part for mounting the workpiece; a heating part which has a resistance heating element and which heats the mounting part; and a support part which supports the mounting part and heating part. The Young's modulus for each of the mounting part and support part is 100 GPa or greater. By having a Young's modulus of 100 GPa or greater, even if the mounting part is thin, there is little deformation when pressed by a probe card.
申请公布号 US2005263516(A1) 申请公布日期 2005.12.01
申请号 US20050140668 申请日期 2005.05.27
申请人 SUMITOMO ELECTRIC INDUSTRIES, LTD. 发明人 NATSUHARA MASUHIRO;NAKATA HIROHIKO;KUIBIRA AKIRA;SHINMA KENJI
分类号 H05B3/20;F27B17/00;F27D11/00;F27D99/00;H01L21/00;H01L21/02;H01L21/66;H01L21/68;H01L21/683;H05B3/06;H05B3/10;H05B3/74;(IPC1-7):F27D11/00 主分类号 H05B3/20
代理机构 代理人
主权项
地址