发明名称 Laminated radiation member, power semiconductor apparatus, and method for producing the same
摘要 A laminated radiation member includes a radiation plate, an insulation substrate bonded to the upper surface of the radiation plate and an electrode provided on the upper surface of the insulation substrate. The laminated radiation member is made by a method including the steps of surface treating a bonding surface of the radiation plate and/or the insulation substrate, interposing ceramic particles surface treated to assure wettability with a hard solder or a metal between the radiation plate and the insulation substrate, disposing a hard solder above and/or below the ceramic particles, heating the hard solder to a temperature higher than the melting point of the solder, penetrating the molten hard solder into spaces between the ceramic particles to react the ceramic particles with the solder to produce a metal base composite material, and bonding the radiation plate and the insulation substrate with the metal base composite material.
申请公布号 US2005263877(A1) 申请公布日期 2005.12.01
申请号 US20050179216 申请日期 2005.07.12
申请人 NGK INSULATORS, LTD. 发明人 ARAKI KIYOSHI;KIDA MASAHIRO;ISHIKAWA TAKAHIRO;BESSYO YUKI;MAKINO TAKUMA
分类号 H01L23/06;H01L23/10;H01L23/15;H01L23/373;H01L23/473;(IPC1-7):H01L23/06 主分类号 H01L23/06
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