| 发明名称 |
ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING SAME |
| 摘要 |
An electronic component includes an electronic chip (110) and a chip carrier portion (120) having sidewalls (121) and a bottom portion (122). The electronic chip is mounted over the bottom portion of the chip carrier portion, and the chip carrier portion shields the electronic chip from radiation outside of the electronic component. |
| 申请公布号 |
WO2004075254(A3) |
申请公布日期 |
2005.12.01 |
| 申请号 |
WO2004US03100 |
申请日期 |
2004.02.04 |
| 申请人 |
FREESCALE SEMICONDUCTOR, INC.;JOHNSON, GARY |
发明人 |
JOHNSON, GARY |
| 分类号 |
H01L23/495;H01L23/552 |
主分类号 |
H01L23/495 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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