发明名称 METHOD FOR ELECTROLESS DEPOSITION AND PATTERNING OF A METAL ON A SUBSTRATE
摘要 A method for manufacturing a patterned metal layer on a substrate is provided which comprises the step of electrolessly depositing a blanket metal film of a metal onto a substrate, followed by subsequently patterning said metal layer by means of microcontact printing. The deposited metal can be overplated with another metal, which can be microcontact printed to serve as an etch mask.
申请公布号 KR100532515(B1) 申请公布日期 2005.12.01
申请号 KR20037013492 申请日期 2003.10.15
申请人 发明人
分类号 H05K3/06;C23C18/16;C23C18/18;H01L21/48;H05K3/00;H05K3/18;H05K3/38 主分类号 H05K3/06
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