发明名称 Solid-state imaging device, semiconductor wafer and camera module
摘要 A light-permeable lid provided oppositely to a photodetector of a solid-state imaging element includes a glass substrate, and an infrared-ray shielding film formed on one side of the glass substrate. The light-permeable lid is disposed so that the side of the light-permeable lid (glass substrate) forming the infrared-ray shielding film is positioned at the opposite side of the side facing the photodetector of the solid-state imaging element. If dust mixes in the infrared-ray shielding film or dust deposits to the film, since the distance from the photodetector to dust (infrared-ray shielding film) is longer, the photodetector is less susceptible to adverse influence of the dust and occurrence of defect due to the dust can be decreased.
申请公布号 US2005264677(A1) 申请公布日期 2005.12.01
申请号 US20050143700 申请日期 2005.06.01
申请人 SHARP KABUSHIKI KAISHA 发明人 UCHIDA KENJI
分类号 H01L27/14;H01L31/0203;H04N5/225;H04N5/335;H04N5/372;H04N5/374;(IPC1-7):H04N5/225 主分类号 H01L27/14
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