发明名称 |
Manufacturing method of semiconductor device |
摘要 |
A manufacturing method of a semiconductor device comprises: (a) setting up a paste including a resin on an electrical connection part which is electrically connected to a semiconductor substrate; (b) setting up a soldering material above the electrical connection part so as to be in contact with the paste; and (c) forming an external terminal from the soldering material and forming a reinforcement from the paste by fusing the soldering material and the paste. The reinforcement exposes part of the external terminal and covers a periphery of an edge of a base connected to the electrical connection part of the external terminal.
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申请公布号 |
US2005266671(A1) |
申请公布日期 |
2005.12.01 |
申请号 |
US20050136309 |
申请日期 |
2005.05.24 |
申请人 |
AOYAGI AKIYOSHI |
发明人 |
AOYAGI AKIYOSHI |
分类号 |
H01L23/12;H01L21/44;H01L21/48;H01L21/60;H01L23/31;H01L23/485;H01L25/065;H01L25/10;H05K3/34;H05K3/36;(IPC1-7):H01L21/44 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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