发明名称 LAMINATED BODY AND SEMICONDUCTOR DEVICE
摘要 <p>A laminated body includes a copper wiring layer (20) arranged in a prescribed pattern on an upper part of a semiconductor layer, a protection layer (30) which is arranged on the copper wiring layer (20) and is composed of a polybenzoxazole resin layer, and an insulating layer (40) arranged on the protection layer.</p>
申请公布号 WO2005114724(A1) 申请公布日期 2005.12.01
申请号 WO2005JP09259 申请日期 2005.05.20
申请人 JSR CORPORATION;SUMITOMO BAKELITE CO., LTD.;SHIRATO, KAORI;SHIOTA, ATSUSHI;TADA, MASAHIRO;ASAKUMA, SUMITOSHI 发明人 SHIRATO, KAORI;SHIOTA, ATSUSHI;TADA, MASAHIRO;ASAKUMA, SUMITOSHI
分类号 C08G73/22;C08L79/04;H01L21/312;H01L21/768;(IPC1-7):H01L21/768 主分类号 C08G73/22
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