发明名称 Method for producing package
摘要 The present invention provides a package realizing a simpler structure, simpler production process, lower product cost, lower production cost, higher strength and excellent appearance. The package is produced by successively forming, on a first surface of a light permeable base, a first printing layer, an anti-offset layer and a second printing layer in a single printing step to give a backing sheet, and allowing the backing sheet to hold an article at the side of a second surface of the base.
申请公布号 US2005262809(A1) 申请公布日期 2005.12.01
申请号 US20050138501 申请日期 2005.05.27
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 TADA FUTOSHI;KUMAKURA KATSUHIKO;UMEDA TOZO;UEMURA KINJI
分类号 B65D75/52;B65B11/50;B65B61/00;B65D75/36;B65D85/88;H01M2/10;(IPC1-7):B65B61/00 主分类号 B65D75/52
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