| 摘要 |
A device package (10) that includes a thin film getter (30) that is deposited on an inside surfaces of a device receiving vacuum sealed cavity or chamber (12, 14). The thin film getter is deposited using, for example, sputtering, resistive evaporation, e-beam evaporation, or any other suitable deposition technique. |
| 申请人 |
HONEYWELL INTERNATIONAL INC.;DCAMP, JON, B.;KOLAND, LISA, P.;GLENN, MAX, C.;CURTIS, HARLAN, L. |
发明人 |
DCAMP, JON, B.;KOLAND, LISA, P.;GLENN, MAX, C.;CURTIS, HARLAN, L. |
