INTEGRATED BALL AND VIA PACKAGE AND FORMATION PROCESS
摘要
A method of processing a semiconductor device is provided. The method includes providing a semiconductor device supported by a carrier structure. The carrier structure defines a plurality of vias from a first surface of the carrier structure adjacent the semiconductor device to a second surface of the carrier structure. The method also includes extending a conductor through one of the vias such that a first end of the conductor at least partially extends below the second surface. The method also includes electrically coupling another portion of the conductor to a portion of the semiconductor device.
申请公布号
WO2005112583(A2)
申请公布日期
2005.12.01
申请号
WO2005US16521
申请日期
2005.05.10
申请人
KULICKE AND SOFFA INVESTMENTS, INC.;BEATSON, DAVID, T.;LING, JAMIN