Optical semiconductor component for light emitting diodes (LEDs) has curved surfaces at whose foci semiconductor chips are placed

摘要

Semiconductor chips are secured on chip carriers (8) fixed on conducting wire holders. The semiconductor chips are placed at the focus of a curved surface (10) made by part of the conducting wire holders, and at the focus of the curved surface (18) surrounded by a package body (16). Connectors (14) are formed by another part of the conducting wire holders.