POLYIMIDE RESIN, MULTILAYER FILM, MULTILAYER FILM WITH METAL LAYER, AND SEMICONDUCTOR DEVICE

摘要

Disclosed is a polyimide resin having a glass transition temperature of 200-320˚C and containing a siloxane diamine residue, a fluorene diamine residue and a specific tetracarboxylic acid dianhydride residue at certain ratios. Also disclosed is a novel polyimide resin composition having high solubility in organic solvents and excellent heat resistance. Further disclosed are a multilayer film and multilayer film with metal layer having high adhesiveness and solder heat resistance, and a highly reliable semiconductor device using such a multilayer film with metal layer.