发明名称 |
Method of fabricating a built-in chip type substrate |
摘要 |
A method of fabricating a built-in chip type substrate containing a semiconductor chip is disclosed. The method comprises a first step of mounting the semiconductor chip on a substrate; a second step of forming chip connection wiring connected to the semiconductor chip mounted on the substrate; and a step of forming an alignment post on the substrate before the first step, the alignment post being used for positioning the chip connection wiring.
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申请公布号 |
US2005266609(A1) |
申请公布日期 |
2005.12.01 |
申请号 |
US20050141421 |
申请日期 |
2005.05.31 |
申请人 |
YAMANO TAKAHARU;ARAI TADASHI |
发明人 |
YAMANO TAKAHARU;ARAI TADASHI |
分类号 |
H01L23/12;H01L21/48;H01L21/58;H01L23/538;H05K1/02;H05K1/18;H05K3/00;H05K3/10;H05K3/46;(IPC1-7):H01L21/48 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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