发明名称 |
[HEAT SINK] |
摘要 |
A heat sink is provided. The heat sink comprises a hollow chassis having a contact face at a bottom portion thereof for attaching to an electronic component and a heat dissipating face at a top portion thereof. A plurality of circularly arranged fins extend from an inner sidewall of the hollow chassis towards a center of the hollow chassis so that gaps between the fins gradually decrease from the inner sidewall of said hollow chassis towards the center of said hollow chassis. At least a heat pipe is positioned between the contact face and the heat dissipating face. At least a fan is positioned at a side of the hollow chassis for generating air to increase an amount of air blowing through wider gaps between said fins to increase the speed of heat dissipation.
|
申请公布号 |
US2005264994(A1) |
申请公布日期 |
2005.12.01 |
申请号 |
US20040711233 |
申请日期 |
2004.09.02 |
申请人 |
GLACIALTECH, INC. |
发明人 |
WANG YING-CHIH;KAO YUNG-CHANG;TSAI CHI-NAN |
分类号 |
F28D21/00;G06F1/20;H01L23/40;H01L23/467;H05K7/20;(IPC1-7):H05K7/20 |
主分类号 |
F28D21/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|