发明名称 |
METHOD FOR MANUFACTURING CONDUCTIVE WAFERS, METHOD FOR MANUFACTURING THIN-PLATE SINTERED COMPACTS, METHOD FOR MANUFACTURING CERAMIC SUBSTRATES FOR THIN-FILM MAGNETIC HEAD, AND METHOD FOR MACHINING CONDUCTIVE WAFERS |
摘要 |
A METHOD FOR MANUFACTURING THIN-PLATE SINTERED COMPACTS ACCORDING TO THE PRESENT INVENTION INCLUDES THE STEPS OF: FORMING A CONDUCTIVE SINTERED COMPACT (10) TO HAVE SUCH A THICKNESS AS TO CAUSE A WARP TO A NEGLIGIBLE DEGREE; AND SLICING THE CONDUCTIVE SINTERED COMPACT (10), THEREBY CUTTING AND DIVIDING THE CONDUCTIVE SINTERED COMPACT INTO AT LEAST TWO WAFERS (10A, 10B).
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申请公布号 |
MY120793(A) |
申请公布日期 |
2005.11.30 |
申请号 |
MYPI9900190 |
申请日期 |
1999.01.16 |
申请人 |
HITACHI METALS, LTD. |
发明人 |
MAKOTO FUKUDA;MASANORI CHIKUBA |
分类号 |
B23H1/00;H01L21/304;B23H7/02;B23H9/00;B23H9/02;B28D1/22 |
主分类号 |
B23H1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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