发明名称 |
A STAINLESS STEEL SHEET HAVING CU-ENRICHED GRAINS DISPERSED IN ITS MATRIX AND/OR A CU-CONDENSED LAYER |
摘要 |
A NEW STAINLESS STEEL SHEET HAS A STAINLESS STEEL SUBSTRATE (1) WHICH CONTAINS CU AT A RATIO OF 1.0 WT. % OR MORE AND HAS CU‾ENRICHED GRAINS (2) PRECIPITATED AT A RATIO OF 0.2 VOL. %. THE CU‾ENRICHED GRAINS (2) ARE EXPOSED OUTSIDE THROUGH PINHOLES (4) OF A PASSIVE FILM (3)GENERATED ON THE SUBSTRATE (1) CU IS PREFERABLY CONDENSED AT A CU/(CR+SI) WEIGHT RATIO OF 0.1 OR MORE OR A CU/(SI+MN) WEIGHT RATIO OF 0.5 OR MORE WITH RESPECT TO CR, SI AND MN PRESENT IN THE PASSIVE FILM (3) OR AT AN OUTERMOST LAYER OF THE SUBSTRATE (J). PRECIPITATION OF CU‾ENRICHED GRAINS (2) AND CONDENSATION OF CU EFFECTIVELY IMPROVE SOLDERABILITY AND ELECTRIC CONDUCTIVITY OF THE STAINLESS STEEL SHEET (1). FIGUR 1 |
申请公布号 |
MY120634(A) |
申请公布日期 |
2005.11.30 |
申请号 |
MY2000PI04332 |
申请日期 |
2000.09.18 |
申请人 |
NISSHIN STEEL CO., LTD. |
发明人 |
NAOTO HIRAMATSU;SADAYUKI NAKAMURA;KAZUYUKI KAGEOKA |
分类号 |
C23C10/00;C21D6/00;C21D8/02;C22C38/04;C22C38/42;C23C8/18 |
主分类号 |
C23C10/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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