SEPARATING SEMICONDUCTOR WAFERS HAVING EXPOSED MICROMECHANICAL STRUCTURES INTO INDIVIDUAL CHIPS,申请号EP20040713843-传众专利搜索

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发明名称	SEPARATING SEMICONDUCTOR WAFERS HAVING EXPOSED MICROMECHANICAL STRUCTURES INTO INDIVIDUAL CHIPS
摘要
申请公布号	EP1599412(A1)	申请公布日期	2005.11.30
申请号	EP20040713843	申请日期	2004.02.24
申请人	X-FAB SEMICONDUCTOR FOUNDRIES AG	发明人	KNECHTEL, ROY;HELLER, JUTTA;LINDEMANN, GUNNAR
分类号	B81C1/00;(IPC1-7):B81C1/00	主分类号	B81C1/00
代理机构		代理人
主权项
地址

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