发明名称 LGA socket contact
摘要 <p>A land grid array (LGA) socket contact (1) comprising a base plate part (2) having side anchoring projections (3), an elastic contact part (6) which is connected via a part (5) that is bent through approximately 180 DEG from a side of the base plate part (2), and which has a curved contact part (9) on its tip for contacting a contact pad of an integrated circuit, the contact (1) also including a board connecting part (10) extending from a lower end of the base plate part (2), connectable by soldering to a circuit board. The size of the elastic contact part (6) in a direction perpendicular to the base plate part (2) in the vicinity of the root of the elastic contact part (6) is minimised, so that inter contact pitch in this direction can be reduced, and allows a large amount of displacement of the elastic contact part (6) so that the connection resistance can be minimised. <IMAGE></p>
申请公布号 EP1401251(B1) 申请公布日期 2005.11.30
申请号 EP20030255558 申请日期 2003.09.05
申请人 TYCO ELECTRONICS AMP K.K. 发明人 SHIRAI, HIROSHI;TAGUCHI, HIDENORI;HASHIMOTO, SHINICHI
分类号 H01R33/76;H01R4/48;H01R13/24;H05K7/10;(IPC1-7):H05K7/10;H01R12/22;H01R12/04 主分类号 H01R33/76
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