JET SOLDER FEEDING DEVICE AND SOLDERING METHOD

摘要

THE PROVIDE A JET SOLDER FEEDING DEVICE ENABLING THE PREVENTION OF POOR WETTING OF A SUBSTRATE AND MOLTEN SOLDER WHICH MAY OCCUR DUE TO GAS OR AIR ACCUMULATED UNDER THE BOTTOM SURFACE OF A SUBSTRATE WHEN THE SUBSTRATE IS CONVEYED TO THE POINT WHERE IT IS FED WITH MOLTEN SOLDER. THE JET SOLDER FEEDING DEVICE IS DESIGNED IN SUCH A MANNER THAT MULTIPLE EJECTING PORTS (22) ARE PROVIDED IN MORE THAN ONE ROWS RELATIVE TO THE SUBSTRATE-CONVEYING DIRECTION (A) AND ARRANGED AT A SECOND PRESCRIBED PITCH (Y) IN LINES SUBSTANTIALLY ALONG MULTIPLE INCLINED LLINES (L) WHICH ARE INCLINED TO THE SUBSTRATE-CONVEYING DIRECTION (A) AND ARRANGED AT A FIRST PRESCRIBED PITCH (X) RELATIVE TO THE DIRECTION (B) PERPENDICULAR TO THE SUBSTRATE-CONVEYING DIRECTION (A), THE FIRST PRESCRIBED PITCH (X) BEING SET TO BE LARGER THAN THE SECOND PRESCRIBED PITCH (Y), SO THAT A FLOW (N) OF MOLTEN SOLDER (J) PASSING THROUGH MIDWAY BETWEEN GROUPS (23) OF THE EJECTING PORTS IS POSITIVEVELY CREATED.