发明名称 RESIN COMPOSITION, MOLDED PRODUCT THEREOF AND ELECTROCONDUCTIVE SHEET
摘要 <p>AN ELECTROCONDUCTIVE SHEET COMPRISING SHEET COMPRISING A SUBSTRATE LAYER OF A THERMOPLASTIC RESIN COMPRISING AN ACRYLONITRILE-BUTADIENE-STYRENE COPOLYMER TYPE RESIN AND/OR A POLYSTYRENE TYPE RESIN AND HAVING LAMINATED ON AT LEAST ONE SIDE OF SUBSTRATE LAYER, A SURFACE LAYER OF AN ELECTROCONDUCTIVE RESIN COMPOSITION COMPRISING A POLYCARBONATE TYPE RESIN AND FROM 5 TO 50 WT% OF CARBON BLACK.</p>
申请公布号 MY120638(A) 申请公布日期 2005.11.30
申请号 MY2000PI05023 申请日期 2000.10.25
申请人 DENKI KAGAKU KOGYO KABUSHIKI KAISHA 发明人 KAZUHIRO KOSUGI;TAKESHI MIYAKAWA;MASANORI HIGANO;MIKIO SHIMIZU
分类号 B32B27/20;B65D73/02;B32B27/08;B32B27/18;B32B27/30;B32B27/36;B42D1/08;B65D65/40;B65D85/86;C08K3/04;C08L69/00 主分类号 B32B27/20
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