发明名称 |
RESIN COMPOSITION, MOLDED PRODUCT THEREOF AND ELECTROCONDUCTIVE SHEET |
摘要 |
<p>AN ELECTROCONDUCTIVE SHEET COMPRISING SHEET COMPRISING A SUBSTRATE LAYER OF A THERMOPLASTIC RESIN COMPRISING AN ACRYLONITRILE-BUTADIENE-STYRENE COPOLYMER TYPE RESIN AND/OR A POLYSTYRENE TYPE RESIN AND HAVING LAMINATED ON AT LEAST ONE SIDE OF SUBSTRATE LAYER, A SURFACE LAYER OF AN ELECTROCONDUCTIVE RESIN COMPOSITION COMPRISING A POLYCARBONATE TYPE RESIN AND FROM 5 TO 50 WT% OF CARBON BLACK.</p> |
申请公布号 |
MY120638(A) |
申请公布日期 |
2005.11.30 |
申请号 |
MY2000PI05023 |
申请日期 |
2000.10.25 |
申请人 |
DENKI KAGAKU KOGYO KABUSHIKI KAISHA |
发明人 |
KAZUHIRO KOSUGI;TAKESHI MIYAKAWA;MASANORI HIGANO;MIKIO SHIMIZU |
分类号 |
B32B27/20;B65D73/02;B32B27/08;B32B27/18;B32B27/30;B32B27/36;B42D1/08;B65D65/40;B65D85/86;C08K3/04;C08L69/00 |
主分类号 |
B32B27/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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