Device for debonding thin wafers

摘要

Sensitive system wafers (4) are held on a carrier (2) by a film of adhesive (3) to form a stack. A robot (10) removes a stack from a storage station (7) to a separating station (13) having a heater (12). The latter weakens the adhesive power of the adhesive enabling an arm (14) to lift the wafer of the carrier and deposit it in a wafer station (8), the carrier being deposited in a carrier storage station (9).