发明名称 Laminate
摘要 <p>The invention relates to a laminate comprising a metal layer which is formed on an covers the surface of an insulating substrate activated by the plasma treatment by any method selected from a sputtering method, a vacuum depositing method and an ion plating method. The substrate is obtained by molding a resin composition containing 20 to 150 parts by mass of a fibrous filler having an average fiber diameter of 0.1 to 5 mu m and an average fiber length of 10 to 50 mu m relative to 100 parts by mass of a base resin comprising a thermoplastic resin and a thermosetting resin.</p>
申请公布号 EP1162866(A3) 申请公布日期 2005.11.30
申请号 EP20010250200 申请日期 2001.06.05
申请人 MATSUSHITA ELECTRIC WORKS, LTD. 发明人 IKEGAWA, NAOTO;KONDO, NAOYUKI;NAKATA, KIMIAKI
分类号 H05K1/03;H05K3/38;(IPC1-7):H05K1/03;C23C14/20 主分类号 H05K1/03
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