摘要 |
Contacts are provided wherewith attachment of a half pitch standard connector to a board can be made with adequate attachment strength, without requiring soldering, which can be easily removed from the board without causing damage to occur. <??>Parts of wiring rounds (155) positioned at the extreme diagonally lower right point on a printed circuit board (149) are clamped from above and below by the upper portion of a wiring round side contact part. The part of the wiring rounds is clamped by the wiring round side contact part, by spring forces that operate in directions to tighten that part, which spring forces develop in the upper portion and the lower portion of the wiring round side contact part. The parts of the other wiring rounds are clamped by spring forces that develop in the upper portion of the wiring round side contact parts and by the lower parts thereof which respectively correspond thereto. <IMAGE> |