发明名称 |
Wiring and method of manufacturing the same, and wiring board and method of manufacturing the same. |
摘要 |
The wiring of the present invention has a layered structure that includes a first conductive layer (first layer) having a first width and made of one or a plurality of kinds of elements selected from W and Mo, or an alloy or compound mainly containing the element, a low-resistant second conductive layer (second layer) having a second width smaller than the first width, and made of an alloy or a compound mainly containing Al, and a third conductive layer (third layer) having a third width smaller than the second width, and made of an alloy or compound mainly containing Ti. With this constitution, the present invention is fully ready for enlargement of a pixel portion. At least edges of the second conductive layer have a taper-shaped cross-section. Because of this shape, satisfactory coverage can be obtained. |
申请公布号 |
SG116443(A1) |
申请公布日期 |
2005.11.28 |
申请号 |
SG20020001417 |
申请日期 |
2002.03.12 |
申请人 |
SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
发明人 |
SHUNPEI YAMAZAKI;HIDEOMI SUZAWA;KOJI ONO;YOSHIHIRO KUSUYAMA |
分类号 |
G02F1/1345;G02F1/1362;H01L21/336;H01L23/528;H01L23/532;H01L27/32;H01L29/786;H01L51/52;(IPC1-7):H01L23/535;H01L21/768;G02F1/368 |
主分类号 |
G02F1/1345 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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