发明名称 Mosfet with electrostaic discharge protection structure and method of fabrication.
摘要 A semiconductor circuit comprises a semiconductor substrate, a semiconductor device having a drain region disposed in the substrate, and a reverse doped region laterally adjacent and laterally contacting the drain region wherein the reverse doped region has an opposite doping type from that of the drain region and a dopant concentration higher than that of the semiconductor substrate, the reverse doped region and the drain forming a p-n junction.
申请公布号 SG116560(A1) 申请公布日期 2005.11.28
申请号 SG20040004838 申请日期 2004.08.17
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. 发明人 SHAO-CHANG HUANG
分类号 H01L21/8234;H01L23/60;H01L27/02;H01L27/088;H01L27/12;H01L29/786;H01L29/94 主分类号 H01L21/8234
代理机构 代理人
主权项
地址
您可能感兴趣的专利