发明名称 Lead frame manufacturing method.
摘要 PROBLEM TO BE SOLVED: To efficiently manufacture a lead frame without requiring a high accuracy in forming an etching pattern to form the lead frame. SOLUTION: The method for manufacturing the lead frame comprises the steps of forming an etching pattern comprising a pattern of a lead frame 12 and a pattern of a connecting part 14 for connecting an end edge of the lead frame 12 adjacent to a longitudinal direction of a workpiece 10 to the long workpiece 10, forming the long body of the lead frame by etching the workpiece 10 with the etching pattern as a mask, and obtaining the sheet lead frame 12 by separating the connected part between the connecting part 14 and the lead frame 12 from the long body of the lead frame. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 SG116647(A1) 申请公布日期 2005.11.28
申请号 SG20050002571 申请日期 2005.04.27
申请人 SHINKO ELECTRIC INDUSTRIES CO., LTD. 发明人 TSUYOSHI KOBAYASHI;YOSHIO FURUHATA;FUMIO YAMAGISHI
分类号 H01L23/50;H01L21/48 主分类号 H01L23/50
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