structure of lead frame for fabricating semiconductor package,申请号KR20000059833-传众专利搜索

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发明名称	structure of lead frame for fabricating semiconductor package
摘要
申请公布号	KR100531422(B1)	申请公布日期	2005.11.28
申请号	KR20000059833	申请日期	2000.10.11
申请人		发明人
分类号	H01L23/48;(IPC1-7):H01L23/48	主分类号	H01L23/48
代理机构		代理人
主权项
地址

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