| 摘要 |
PROBLEM TO BE SOLVED: To provide a semipermanent mold for forming a fine pattern on the surface of a semiconductor, and to provide its production process. SOLUTION: In the mold having protrusions and recesses 11d and 11e on the surface of a mold body for transferring a fine pattern to the surface of a semiconductor substrate, the mold body 11c being provided with the protrusions and recesses 11d and 11e is formed of silica glass 11, an SiO<SB>2</SB>film 15a doped with at least one kind of P<SB>2</SB>O<SB>5</SB>, B<SB>2</SB>O<SB>3</SB>and GeO<SB>2</SB>is formed on the mold surface on the side of protrusions and recesses, and a substantially hemispherical or rounded forward end part 15b is formed by treating the SiO<SB>2</SB>film on the surface of the protrusion 11e. Its production process is also provided. COPYRIGHT: (C)2006,JPO&NCIPI
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