| 摘要 |
PROBLEM TO BE SOLVED: To prevent positional slippage of an IC device while applying pressing force on it, by reducing operating force of a pressing member and enlarging the dimension of the pressing surface of the pressing member, in an IC socket. SOLUTION: This IC socket 10 is equipped with a housing 14 having a supporting part 12, a plurality of contacts 16, the pressing member 18 to press an IC device supported by the supporting part toward the group of the contacts, and an energizing mechanism 22 to generate pressing force to press the IC device against the pressing member. The pressing member has a spindle 42 guided on the housing in a directly driven mode, and the pressing surface which can be rockingly displaced on the housing with the spindle as a center, and the energizing mechanism 22 makes the pressing surface produce pressing force by applying energizing force to the spindle of the pressing member. The pressing surface of the pressing member parallel moves between an operating position where it comes closest to the supporting part and a first non-operating position where it parts away from the supporting part, and produces rocking displacement between the first non-operating position and a second non-operating position where it parts further away form the supporting part. COPYRIGHT: (C)2006,JPO&NCIPI
|
