发明名称 Heat dissipating device
摘要 A heat dissipating device includes a heat receiver, a fin member including a plurality of spaced fins defining aligned holes, and at least one heat pipe connecting the heat receiver with the fin member. Some of the fins adjacent the heat receiver define enlarged openings each communcating with a corresponding hole. The at least one heat pipe is U-shaped and includes an evaporative section attached to the heat receiver, a pair of condesative sections received in the holes of the fins, and a pair of curved sections connected between opposite ends of the evaporative section and the condensative sections respectively and received in the enlarged openings.
申请公布号 US2005257920(A1) 申请公布日期 2005.11.24
申请号 US20050107714 申请日期 2005.04.15
申请人 FOXCONN TECHNOLOGY CO., LTD 发明人 SHENG JIAN-QING;LEE MENG-TZU;LIN SHU-HO
分类号 F28D15/00;F28D15/02;F28F3/02;G06F1/20;H01L23/34;H01L23/427;(IPC1-7):F28D15/00 主分类号 F28D15/00
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